Arlon Electronic Materials introduces 84HP high-performance 250⁰C Tg temperature polyimide resin prepreg. Arlon developed 84HP as a prepreg bonding companion to Arlon’s 85HP filled pure polyimide resin laminate system. 84HP is designed for use in filling etched areas in polyimide multilayers that contain thick copper metal cores.
A proprietary filler is dispersed within the 84HP and 85HP polyimide resin which serves to reduce shrinkage and inhibit crack formation during lamination and through-hole mechanical drilling processes. This unique formulation has proven benefits such as improved drilling over conventional polyimide resin systems, predictable dimensional stability, and reduction in gouging and glass wicking during hole formation.
Additional benefits include X-Y expansion rates very close to copper (16-18 ppm/⁰C), and very low Z-axis of <1%, the lowest Z-axis expansion of any polyimide in the industry. Arlon’s 84HP is manufactured on 50” wide 106 E-glass matching the grain direction of 85HP. 84HP meets the requirements of IPC-4101/40 and IPC-4101/41.
Dave Nelson, director of business development for Arlon, stated: “The performance requirements of IPC-6012DS, an addendum to IPC-6012D, specify that printed circuits boards manufactured to this added level of reliability must survive vibration, ground testing and thermal cycling environments of space and military avionics. These requirements can be achieved by using 84HP as the bonding layers for the 85HP etched laminates. Additional benefits using this combination are 2X thermal conductivity versus conventional polyimide systems for improved component longevity and lower component junction temperatures.”
Applications for Arlon’s 85HP and 84HP include high layer count MLB’s incorporating several sequential lamination operations, thick copper MLB’s, high power copper internal planes, deep space electronics, down-hole oil and gas drill equipment, engine control modules, rocket motor controls, and avionic electronics.