High Temp Exposure
Many electronics applications, such as down-hole gas and oil exploration, integrated circuit burn-in fixtures, and under-hood automotive devices present thermal and environmental challenges for base materials. Some applications may see continuous use temperatures of 250°C or greater for extended periods of time. Others may require shorter exposures of 350°C or more.
Arlon’s 85HP and 85N polyimide materials are designed to meet these challenges with their high glass transition temperatures and robust thermal decomposition temperatures.
Arlon’s 85HP is a unique blend of pure polyimide resin and micro-fine proprietary fillers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin flow characteristics and pressed thickness matching standard polyimides and meets the requirements of IPC-4101E/40 and /41.
85N is a pure polyimide resin system for PWB’s requiring resistance to high temperature with decomposition temperatures greater than 400°C, and glass transitions of 250°C. Bromine-free chemistry provides Best in-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications. 85N meets the requirements of IPC-4101E/40 and /41.
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