PRODUCTS

ELECTRONIC MATERIALS – Product Listing & Typical Properties

Resin Product Description Tg
̊C
Z Axis Expansion (%) UL-94 Rating Td 5%
( ̊C)
H20 Absorp (%) Tc (W/m-K) IPC4101* Class Comments
Polyimide Products

Flame Retardant Polyimide

250

1.2

V0

389

0.21

0.20

GIL / 40 / 41

Max Flame Retardance

Flame Retardant Polyimide

250

1.2

V1

407

0.26

0.20

GIL / 40 / 41

Reduced Cure Time

Powdered Poly Hole Fill Compound

250

0.55

N/A

>400

0.40

0.50

N/A

Hole/Via Fill Compound

Filled Polyimide Prepreg

250

1.0

Meets HB

407

0.30

0.25

GIL / 40 / 41

For Via/Clearance Hole Filling

High Temp Polyimide

250

1.2

HB

407

0.27

0.20

GIL / 40 / 41

Optimum Long Term Stability

High Performance Polyimide

>250

1.0

Meets HB

430

0.32

0.50

GIL / 40 / 41

Tc (W/mK) is 2x Polyimide

Low Flow Products

Low Flow Polyimide Prepreg

200

2.3

Meets V0

340

<1.00

0.30

GIJ /42

Rigid Flex Applications

2nd Gen Low Flow Polyimide Prepreg

200

1.5

Meets V0

330

<1.00

0.30

GIJ /42

Enhanced Rheology Rigid Flex

Modified Epoxy Low Flow

135

3.5

V0

315

0.10

0.25

GFG /21

Heat Sink Bond, Low Temp Cure

Multifunctional Epoxy Low Flow

170

3.1

V0

303

0.10

0.25

GFG /26

Rigid-Flex, Heat Sinks

Lead-Free Epoxy Low Flow

170

1.2

V0

358

0.15

0.25

GFG /126

Lead-Free Solderable, Rigid-Flex

Epoxy Products

44N

Filled Epoxy Prepreg

170

2.2

V0

>300

0.10

0.30

GFG /98

For Via/Clearance Hole Fill

Multifunctional Epoxy

175

2.4

V0

>300

0.10

0.25

GFG /26

High Layer Count MLBs

Controlled Thermal Expansion / SMT

Woven Aramid Reinforced Epoxy

170

2.8

V0

>300

0.80

0.22

AFN /50

Kevlar® X-Y CTE of 5-7 ppm/°C

Epoxy Nonwoven Aramid

170

3.5

V0

368

0.30

0.20

BFG /55

X-Y CTE of 6-9 ppm/°C

Polyimide Nonwoven Aramid

250

2.3

Meets HB

426

0.60

0.20

BIL /53

X-Y CTE of 7-9 ppm/°C

Polyimide Clad with CIC

250

1.5

HB

407

0.20

0.27

GIL / 40 / 41

CIC = Copper-Invar-Copper

Additional Product Information

Reverse Treated and Double Treated Foils are available upon request

Thin copper foils are available for ultra fine-line applications

50 or 100 Ohm/Square Omega-Ply® or Ticer resistive foils are available for manufacturing Etched Planar Resistors

All products are manufactured using E-Type Fiberglass unless otherwise specified.

   *Latest revision