Chip Carriers and Interposers use printed wiring material to make the final connection between semiconductor devices and multilayer PWBs. Arlon’s 85NT can be used to match expansions where the chip carriers have a low in-plane CTE. For direct chip applications, 45NK has a CTE of 5-7 ppm/°C to very closely match silicon.
Burn-in testing of ICs requires test-board materials that will survive high temperatures and multiple thermal and power cycles. Burn-in may also require frequent mounting and demounting of chip test sockets. Polyimide materials are ideal for these applications due to their high reliability and long life in these conditions.
Other semiconductor tests include DUT, HAST, Probe Card, and many others. The reliability of polyimide materials to survive assembly and application environment make it the best choice for your application.
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