Laser Drilled Materials

The most cost-effective path for the fabrication of densely populated circuit boards is the design of multi-depth blind microvias in-pad technology. It has been proven for some time now that blind microvias within SMD Pads can substantially reduce the number of layers for a dense circuit board design, and in addition allow for denser component placement.

Non-woven aramid reinforced materials provide excellent via quality, speed of laser processing, and exceptional dimensional stability for alignment of stacked microvias.

Another option is the 85HP product. Tnis material utilizes square and spread glass fabric reinforcements to minimize high glass densities and resin rich areas to provide more uniform via quality. The ceramic filler in the resin contributes to making the composite more homogeneous as seen by the laser beam.

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