Controlled Flow Prepreg

Low-Flow prepreg, also referred to in some cases as “No-Flow” prepreg, is engineered to have a controlled melt viscosity that results in controlled low flow for laminating rigid flex products or bonding heat sinks to printed wiring boards. Characterized by a high melt viscosity, Low-Flow prepregs do not flow excessively into cutouts in heat sinks or past the edge of the rigid segment of a rigid-flex board, so that insertion of devices into cutouts is enabled, and flexibility of the flex section of the board is maintained. Arlon manufactures a range of Low-Flow prepregs designed for a variety of heat sink and rigid-flex bonding applications. Individual product lines may also have some variation in available glass styles and flow ranges to further provide optimized materials for specific applications.

Additional Information

Other Areas